A. F. Molisch,
Area Editor
University of Southern California
C.-C. Chong
DoCoMo USA Labs
X. Gao
Southeast University China
S. Ghassemzadeh
AT&T Labs - Research
M. O. Pun
Mitsubishi Electric Research Laboratories (MERL)
H. Shin
Kyung Hee University
F. Tufvesson
Lunds University
M. Win
Massachusetts Institute of Technology
J. Wu
University of Arkansas
C. Yang
Beihang University
T. Zemen
FTW. Forschungszentrum Telekommunikation Wien |
Y. Li,
Area Editor
Georgia Institute of Technology
S. Affes
INRS-EMT
M. Bhatnagar
Indian Institute of Technology
D. Dardari
University of Bologna at Cesena
Y. C. Ko
Korea University
Y. Li
NICTA
D. Reynolds
West Virginia University
S. Sfar
Interdigital Communications
M. Torlak
The University of Texas at Dallas
S. Wei
Louisiana State University
W. Zhang
The University of New South Wales |
H. Jafarkhani,
Area Editor
University of California, Irvine
A. Chockalingam
Indian Institute of Science
A. Ghrayeb
Concordia University
A. Kwasinski
Rochester Institute of Technology
K. B. Lee
Seoul National University
T. J. Li
Lehigh University
Y. Mao
University of Ottawa
A. Nosratinia
University of Texas at Dallas
A. Sezgin
Ulm University
D. Tuninetti
University of Illinois at Chicago
G. Yue
NEC Laboratories America
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R. K. Mallik,
Area Editor
Indian Institute of Technology, Delhi
M. Ardakani
University of Alberta
S. Bhashyam
Indian Institute of Technology, Madras
X. Dong
University of Victoria
M. J. Hossain
INRS-EMT
K. S. Kim
Yonsei University
X. Ma
Georgia Institute of Technology
M. McKay
Hong Kong University of Science and Technology
N. C. Sagias
University of Peloponnese, Greece
Y. Sanada
Keio University
Z. Wang
Tsinghua University
Y. J. Zhang
The Chinese University of Hong Kong |
V. K. N. Lau,
Area Editor
Hong Kong Univerisity of Science and Tech.
G. Abreu
University of Oulu
S. Aissa
Universite du Quebec
S. Bahk
Seoul National University
W. Choi
Korea Adv. Inst. of Sc. & Tech.
M. C. Gursoy
University of Nebraska-Lincoln
Z. Han
University of Houston
D. Niyato
Nanyang Technological University
P. Popovski
Aalborg University
J. M. Shea
University of Florida
G. Song
SiBEAM Inc
H. Yousefi'zadeh
University of California Irvine |
C. Tellambura,
Area Editor
University of Alberta
S. Blostein
Queen's University
J. Coon
Toshiba Telecomm. Research Lab.
L. Deneire
University of Nice
A. Gulliver
University of Victoria
Y. Jing
University of Alberta
H. Lin
Osaka Prefecture University
J. Luo
Colorado State University
L. Sanguinetti
University of Pisa
G. Wunder
Fraunhofer Heinrich Hertz Institute
X.-G. Xia
University of Delaware |
G. Bianchi,
Area Editor
University of Rome Tor Vergata
Past Area Editor
E. Hossain,
University of Manitoba
C. F. Chiasserini
Politecnico di Torino
S. Cui
Texas A&M University
N. Devroye
University of Illinois at Chicago
N. Kato
Tohoku University, Japan
S. Liew
Chinese University of Hong Kong
S. Mao
Auburn University, AL
M. L. Merani
University of Modena and Reggio Emilia
M. Rossi
University of Padova
S. Valaee
University of Toronto
P. Wang
Nanyang Technological University
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T. Hou,
Area Editor
Virginia Tech
A. Abouzeid
Rensselaer Polytechnic Institute
L. Cai
University of Victoria
Y. Chen
Stevens Institute of Technology
Y. Guan
Iowa State University
J. Huang
Chinese University of Hong Kong
B. Krishnamachari
University of Southern California
B. Liang
University of Toronto
L. Libman
The University of Sydney
S. Shakkottai
Texas A&M University
D. Tarchi
University of Florence
G. Zussman
Columbia University
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